PB-FREE SOLDER-CONNECTED STRUCTURE AND ELECTRONIC DEVICE

摘要

An electronic device comprising a substrate and a semiconductor device both of which are connected with each other by means of a Pb-free solder. The Pb-free solder comprises Bi. The semiconductor device has a lead thereon. The lead has an Sn-Bi alloy layer comprising 1 to 20 wt%. The lead may be composed of Cu or a Cu alloy, or an Fe-Ni alloy.