发明名称 Semiconductor device with flowable insulation layer formed on capacitor and method for fabricating the same
摘要 Disclosed is a semiconductor device with a flowable insulation layer formed on a capacitor and a method for fabricating the same. Particularly, the semiconductor device includes: a capacitor formed on a predetermined portion of a substrate; an insulation layer formed by stacking a flowable insulation layer and an undoped silicate glass layer on a resulting substrate structure including the substrate and the capacitor; and a metal interconnection line formed on the insulation layer. The method includes the steps of: forming a capacitor on a predetermined portion of a substrate; forming an insulation layer by stacking a flowable insulation layer and an undoped silicate glass layer on a resulting substrate structure including the substrate and the capacitor; and forming a metal interconnection line on the insulation layer.
申请公布号 US7538007(B2) 申请公布日期 2009.05.26
申请号 US20040008908 申请日期 2004.12.10
申请人 发明人
分类号 H01L21/8242;H01L27/108;H01L21/02;H01L23/532 主分类号 H01L21/8242
代理机构 代理人
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