发明名称 |
CUTTING TIP FOR DIAMOND TOOL AND DIAMOND TOOL |
摘要 |
The present invention relates to a cutting tip for a diamond tool and a diamond tool having the same which serve to cut or perforate various brittle materials such as stone, brick, concrete and asphalt. In particular, the cutting tip for a diamond tool and the diamond tool have diamond particles which are suitably arrayed to improve the cutting rate. The present inventio n provides a cutting tip for a diamond tool having diamond particles which are distributed in the cutting tip, wherein the diamond particles are inclined i n respect to a cutting direction in a plane parallel to a cutting surface, and arrayed whereby grooved channels are formed successively overlapped on a brittle substance in cutting operation.
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申请公布号 |
CA2474743(C) |
申请公布日期 |
2009.05.26 |
申请号 |
CA20032474743 |
申请日期 |
2003.02.07 |
申请人 |
EHWA DIAMOND INDUSTRIAL CO., LTD.;GENERAL TOOL, INC. |
发明人 |
KIM, SOO-KWANG;PARK, HEE-DONG;KIM, JONG-HO |
分类号 |
B23P5/00;B24D3/00;B23D61/18;B24D3/06;B24D5/06;B24D5/12;B28D1/04;B28D1/12 |
主分类号 |
B23P5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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