发明名称 |
Method of making multi-chip package with high-speed serial communications between semiconductor dice |
摘要 |
A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
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申请公布号 |
US7537960(B2) |
申请公布日期 |
2009.05.26 |
申请号 |
US20080972602 |
申请日期 |
2008.01.10 |
申请人 |
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. |
发明人 |
KELLY MICHAEL G.;CHENARD PAUL G.;POLISETTI REVATHI UMA;MCKINLEY PATRICK A. |
分类号 |
H01L21/00;H01L21/30;H01L23/22;H01L23/24;H01L23/48;H01L23/52;H01L25/04;H01L25/065;H01L25/18;H01L29/40 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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