发明名称 METHOD FOR FORMING SPUTTERING FILM ON THREE-DIMENSIONAL WORK AND APPARATUS USED IN THE METHOD
摘要 <p>Provided is a sputtering technology for uniformly forming a film with sputter particles even on a work having a complicated three-dimensional shape. The film is formed on the three-dimensional work, which is attached to a rotating carousel-type work holder arranged to face the target, by sputtering the target. The three-dimensional work is rotated by means of a shaft arranged within a surface vertical to a surface which connects the target and the rotating shaft of the carousel-type work holder. At least for a partial time during the total sputtering time, the main scattering direction of the spatter particles scattering from the target is permitted to be a direction decentered from the center direction of the rotating shaft of the carousel-type work holder.</p>
申请公布号 WO2009063789(A1) 申请公布日期 2009.05.22
申请号 WO2008JP70178 申请日期 2008.11.06
申请人 EBARA-UDYLITE CO., LTD.;HORIE, KUNIAKI;TAKAHASHI, NAOKI;YOSHIOKA, JUNICHIRO 发明人 HORIE, KUNIAKI;TAKAHASHI, NAOKI;YOSHIOKA, JUNICHIRO
分类号 C23C14/34 主分类号 C23C14/34
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