发明名称 MICRORELAY
摘要 PROBLEM TO BE SOLVED: To provide a microrelay excellent in sealability and capable of simplifying manufacturing processes. SOLUTION: The microrelay includes a fixed substrate having fixed contacts and fixed electrodes, a cap substrate arranged in opposition to the fixed substrate, and a movable plate arranged between the fixed substrate and the cap substrate. The movable plate includes a frame part and a plurality of movable parts fitted in free movement to the frame part. The frame part is sealed and jointed between the fixed substrate and the cap substrate. Each movable part is provided with a movable electrode facing to the fixed electrode and a movable contact at a position corresponding to the fixed contact point, and moves between the fixed substrate and the cap substrate based on electrostatic attractive force generated between the movable electrode and the fixed electrode. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009110974(A) 申请公布日期 2009.05.21
申请号 JP20090009317 申请日期 2009.01.19
申请人 FUJITSU COMPONENT LTD 发明人 IWATA HIDEKI;YUZUBA YOSHITSUGU;SASO HIROFUMI
分类号 H01H59/00;B81B3/00 主分类号 H01H59/00
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