| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board inspecting device for measuring the displacement of a resist plane with each of regular reflection light and irregular reflection light, estimating the position of a pad plane under a resist based on the correlation between both, and determining the solder height from the position. SOLUTION: First sensing means OS1, D1 and D2 receive scattered light including the light that transmits through a resist plane and is reflected on the surface of a substrate and measure the first displacement, and second sensing means OS2 and D3 measure regularly reflected light, measure the second displacement, and previously store a corrected value indicating the relationship between the difference between them and the thickness of the resist in a corrective memory 5. Then, the first and second sensing means determine the first and second displacements on the resist plane of the substrate. Next, a correction value is determined referring to the corrective memory based on the difference between them, and a pad plane position is determined by subtracting the correction value from the second displacement. The displacement of the surface of a printed solder place is determined as a displacement from the pad plane based on the displacement determined by the first or second sensing means. COPYRIGHT: (C)2009,JPO&INPIT
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