| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for a multilayer printed wiring board which is uniform even if it contains a coloring agent and an inorganic filler with low solvent solubility, and to provide a prepreg and a resin sheet using the uniform resin composition for the multilayer printed wiring board and having no aggregate and further having no unevenness and no aggregate in appearance. SOLUTION: The resin composition contains a molten mixture formed by heating, melting, and mixing (A) a thermosetting resin whose softening point or melting point being≤50°C, and (B) an organic coloring agent together. COPYRIGHT: (C)2009,JPO&INPIT |
