| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit member mounting method capable of sufficiently and efficiently suppressing deformation of a circuit member. <P>SOLUTION: In the circuit member mounting method, the circuit member is mounted by using a crimping head for pressing the circuit member in the direction of a substrate, and a heat crimping process in which a circuit connecting material is interposed between the substrate and the circuit member, and the circuit member pressed onto the substrate by the crimping head to bond both of them while heating the circuit connecting material to have a prescribed temperature is provided. In this heat crimping process, when pressing by the crimping head, an insulating film having a thickness of 90 μm or less and an elastic modulus of 0.5 GPa or more at the prescribed temperature is interposed between the crimping head and the circuit member. <P>COPYRIGHT: (C)2009,JPO&INPIT |
