发明名称 TREATMENT METHOD AND APPARATUS FOR PERIPHERY PORTION OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To efficiently and effectively treat the periphery portion of a substrate having surface roughness or defect, or an unnecessary adhered material etc. becoming a pollution source which has occurred. SOLUTION: The treatment method of the periphery portion of the substrate for carrying out the treatment of the substrate surface in the periphery portion of the substrate includes the surface state monitoring step for monitoring the surface state in the periphery portion of the substrate, the treatment condition determining step for determining the substrate surface treatment condition for executing the treatment of the substrate surface and including the existence of the necessity of the treatment of the substrate based on the monitoring result of the surface state, and the substrate surface treatment step for executing the treatment of the substrate surface for the periphery portion of the substrate when there is the necessity for the treatment of the substrate surface. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009111079(A) 申请公布日期 2009.05.21
申请号 JP20070280663 申请日期 2007.10.29
申请人 TOSHIBA CORP 发明人 FUKUSHIMA MASARU;SHIGETA ATSUSHI;TATEYAMA YOSHIKUNI;NISHIOKA TAKESHI
分类号 H01L21/304;B24B9/00;H01L21/66 主分类号 H01L21/304
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