发明名称 |
MULTI-CHIP PACKAGE SEMICONDUCTOR DEVICE |
摘要 |
An efficient logic chip operating power supply having digital circuits in a multi-chip package is provided. A multi-chip package semiconductor device fabricated in common with a driver chip having analog circuits and a logic chip having digital circuits, a logic chip power supply circuit is provided in which a driver chip creates a logic chip power supply dedicated for the logic chip. The logic chip has internal logic circuitry operating by receiving a power supply from the logic chip power supply circuit via power input terminals.
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申请公布号 |
US2009128229(A1) |
申请公布日期 |
2009.05.21 |
申请号 |
US20070945030 |
申请日期 |
2007.11.26 |
申请人 |
SANYO ELECTRIC CO., LTD.;SANYO SEMICONDUCTOR CO., LTD. |
发明人 |
WATANABE TOMOFUMI;NORO SATOSHI;YOKOO SATOSHI |
分类号 |
H03K3/38 |
主分类号 |
H03K3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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