| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed-circuit substrate and a manufacturing method therefor. <P>SOLUTION: The printed-circuit substrate is provided with an insulating layer 23; circuit patterns 25 formed on the upper and lower surfaces of the insulating layer 23; and a bump 22, formed by penetrating the insulating layer 23 so that the circuit pattern 25 is electrically connected to it, wherein an alloy layer 26 for increasing contact force between the circuit pattern 25 and the bump 22 is interposed between the bump 22 and the circuit pattern 25. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
