| 摘要 |
PROBLEM TO BE SOLVED: To cope with miniaturization and to facilitate manufacturing by providing a bonding metal film on the face of a frame directed in the same direction as the bottom face of a recess. SOLUTION: A piezoelectric vibrator is manufactured by performing: a through-hole formation step of providing a through-hole at a position corresponding to the wiring pattern of a substrate; a pattern formation step of forming the wiring pattern and an external terminal on the substrate and filling the through-hole with conductive material; a piezoelectric vibrating element mounting step of mounting a piezoelectric vibrating element 20 on the wiring pattern; and a bonding step of bringing a cover 30 into contact with the substrate, wherein the cover 30 includes a recess 33 constituted of a plate and a frame and includes a bonding metal film 34 within the recess and on the face of a frame 32 directed in the same direction as the bottom face of the recess, and bonding the substrate and the cover by positive electrode bonding. COPYRIGHT: (C)2009,JPO&INPIT
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