| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible circuit board to be completed by using a washing process, which is simple in manufacture process, matches the demand of environmental preservation, and by which a circuit diagram by a conductive material is more complete and the inspection pass rate of quality becomes further high. SOLUTION: A high molecular polymer or a copolymer compound is selected and turned to a base material 1, also a hydrophilic material is selected to print a release layer 2 leaving the circuit diagram on the base material 1 beforehand, and a sputtering or steam plating method is selected to connect the conductive material to the circuit diagram which is left further. Or, a plating process is performed further as needed to increase the thickness of a conductive material layer 3, and the release layer 2 is removed through the washing process to form the flexible printed circuit board. The flexible circuit board is molded, cut, then sent to extrusion molding further and directly manufactured into the inner and outer members of various kinds of electronic products. COPYRIGHT: (C)2009,JPO&INPIT
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