发明名称 METHOD FOR TREATING SUBSTRATE, METHOD FOR CONVEYING SUBSTRATE, AND APPARATUS FOR CONVEYING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for treating a substrate capable of keeping the inside of an exposure apparatus clean and reducing a pressure change, a method for conveying the substrate, and an apparatus for conveying the substrate. SOLUTION: The method for treating the substrate before exposing the substrate to which a resist is applied includes a process of baking the substrate to which the resist is applied, and a process of holding the baked substrate in an atmosphere which substantially includes no moisture until conveying the substrate to the exposure apparatus. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009111186(A) 申请公布日期 2009.05.21
申请号 JP20070282374 申请日期 2007.10.30
申请人 TOSHIBA CORP 发明人 MATSUNAGA KENTARO;KAWAMURA DAISUKE;MITSUYOSHI YASURO;SHIOBARA HIDESHI
分类号 H01L21/027 主分类号 H01L21/027
代理机构 代理人
主权项
地址