发明名称 |
ADHESIVE RESIN AND FILM ADHESIVES MADE BY USING THE SAME |
摘要 |
The adhesive resin of the invention comprises a polyimide resin obtained by reacting a diamine component containing the compound (1) as an essential component with a tetracarboxylic dianhydride component. <CHEM> <??>The diamine component contains a silicone diamine having a specific structure and/or the tetracarboxylic dianhydride component contains a silicone acid dianhydride having a specific structure. Film adhesives made by using the adhesive resin preferably together with a thermosetting resin, and, if necessary, an inorganic filler are excellent in low-temperature adhesion, resistance to moisture absorption, heat resistance, and workability in adhesive adhering and are favorably usable as semiconductor-mounting materials for adhering semiconductor elements to substrates. |
申请公布号 |
EP1508584(B1) |
申请公布日期 |
2009.05.20 |
申请号 |
EP20030733169 |
申请日期 |
2003.05.29 |
申请人 |
MITSUI CHEMICALS, INC. |
发明人 |
KINOSHITA, JIN;MORITA, MORITSUGU;MORI, MINEHIRO;KODAMA, YOICHI |
分类号 |
C09J7/02;C08G73/10;C08L63/00;C09J7/00;C09J179/08;H01L21/58 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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