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发明名称
Electroless gold plating solution
摘要
An electroless gold plating solution that can form a gold plating film with excellent adhesion and that does not cause corrosion of a base metal film such as nickel, copper, cobalt, or palladium, or the like.
申请公布号
US7534289(B1)
申请公布日期
2009.05.19
申请号
US20080217241
申请日期
2008.07.02
申请人
ROHM AND HAAS ELECTRONIC MATERIALS LLC
发明人
YOMOGIDA KOICHI
分类号
C23C18/31
主分类号
C23C18/31
代理机构
代理人
主权项
地址
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