| 摘要 |
PROBLEM TO BE SOLVED: To diffuse heat generated associated with ink-ejection from a head chip mounted on a base plate, then, to enhance heat dissipation efficiency. SOLUTION: One end of a heat pipe 5 is thermally bonded to the base plate 2, and the other end of the heat pipe 5 is thermally bonded to a chip tank 3, then, the heat generated associated with the ink-ejection from the heat chip 1 is directly guided to the chip tank 3 and diffused. COPYRIGHT: (C)2009,JPO&INPIT
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