发明名称 PACKAGE STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a package structure capable of having a suppressed manufacturing cost. <P>SOLUTION: Projections 81 to 84, 91, and 92 for pressing a product 2 against the surface 53 of an accommodating part 52 formed in an accommodating member 11 are formed from linear grooves 111 to 116 formed so as to be retracted inward from the outer face of the accommodating part 52, respectively. These grooves 111 to 116 extend in the bulging direction B of the accommodating part 52. Accordingly, when the accommodating member 11 is molded from a sheet, the direction of the opening of the accommodating part 52 and the extending directions of the respective grooves 111 to 116 are set in a direction in which a mold is removed. Thereby, the accommodating section 52 and the projections 81 to 84, 91, and 92 can be molded simultaneously. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009102043(A) 申请公布日期 2009.05.14
申请号 JP20070275851 申请日期 2007.10.24
申请人 ST KK 发明人 SHIMIZU TOMOMITSU
分类号 B65D75/36;B65D1/26 主分类号 B65D75/36
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