| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for a light emitting element package, which can obtain sufficient heat dissipation effect from a light emitting element and can be mass-produced, and made inexpensive and compact as a substrate for packaging the light emitting element, to provide a manufacturing method thereof, and to provide the light emitting element package using the substrate for the light emitting element package associated therewith. <P>SOLUTION: Disclosed is the substrate for the light emitting element package having a metal thickness portion 2 formed below the mounting position of the light emitting element 4, the substrate for the light emitting element package having an insulating layer 1 made of a resin containing a thermally conductive filler and having a thermal conductivity of ≥1.0 W/mK below the mounting position of the light emitting element and a metal layer 21 having the metal thickness portion 2 disposed in the insulating layer 1 and being provided with a thermally conductive mask portion 22 at the top of the metal thickness portion 2. <P>COPYRIGHT: (C)2009,JPO&INPIT |
