COPPER FOIL FOR PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide copper foil for a printed wiring board capable of responding to further miniaturization of circuit wiring in a flexible printed wiring board or the like, and having high joint strength relative to a conventional one in jointing of the copper foil to a base material for a printed wiring board. SOLUTION: In the copper foil for a printed wiring board, a rustproof treatment layer and a silane coupling treatment layer are sequentially stacked on the copper foil. The copper foil for a printed wiring board wherein an adsorption rate between the rustproof treatment layer and the silane coupling treatment layer is 10-40% is manufactured by using an aqueous solution in which the concentration of a silane coupling agent is 10-40 atomic% when the silane coupling treatment layer is stacked. COPYRIGHT: (C)2009,JPO&INPIT