| 摘要 |
A method for forming a stacked layer with a reduced surface roughness that includes at least a metal film and an anti-reflection coating thereon is described. A sputtering process is conducted using a metal target to deposit a layer of metal on a substrate, wherein the DC power density over the sputtered surface of the metal target is set higher than 5 W/inch2, and the layer of metal has a thickness of 4000 Å or less. A cooling step is performed, and then an anti-reflection coating is deposited on the metal film at a temperature of 300° C. or lower.
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