| 摘要 |
<P>PROBLEM TO BE SOLVED: To examine a metal foil, a polyimide resin substrate or the like which composes a metal foil lamination polyimide resin substrate, and especially a metal foil surface and to provide a metal foil lamination polyimide resin substrate in which fine pitch wiring can be formed, and the surface of a polyimide resin substrate which is cleared of a metal foil such as a copper foil by etching or the like has the improved adhesion with an organic material of adhesiveness such as an anisotropic electric conductive film. <P>SOLUTION: The metal foil lamination polyimide resin substrate comprises directly laminating a metal foil to one side or both sides of a polyimide resin substrate, and is characterized in that in the adhesion surface with the polyimide resin substrate of the metal foil, the surface roughness (Rzjis) is at most 3.0 μm, the value of a surface area ratio (B) computed by the ratio [A/6, 550] of the surface area (three-dimensional area: A μm<SP>2</SP>) when measuring a two-dimensional domain having the surface area of 6, 550 μm<SP>2</SP>by a laser method to the two-dimensional domain area is in the range of 1.25-2.50, and the quantity of chromium per unit area of the two-dimensional domain is at least 2.0 mg/m<SP>2</SP>. <P>COPYRIGHT: (C)2009,JPO&INPIT |
