| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module that not only eliminates the need for a large size cooling structure but also achieves a compact size. SOLUTION: The power module includes a substrate 60 having a first main substrate surface 61 and second main substrate surface 62 opposite to the first main substrate surface 61, and a switching element 10 disposed on the first main substrate surface 61, having a first main surface 11 on which a source electrode 10s is formed, and a second main surface 12 on which a drain electrode 10d opposite to the first main surface 11 and adjacent to the first main substrate surface 61 is formed. Further, the power module includes a heat transmission portion 40 disposed on the first main substrate surface 61 and an upper cooling portion 50 disposed on the heat transmission portion 40 in a space left to the region on which the switching element 10 is disposed. COPYRIGHT: (C)2009,JPO&INPIT |
