AN INTERCONNECT STRUCTURE AND A METHOD OF FABRICATING THE SAME
摘要
An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.
申请公布号
WO2009061282(A1)
申请公布日期
2009.05.14
申请号
WO2008SG00406
申请日期
2008.10.21
申请人
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH;NANYANG TECHNOLOGICAL UNIVERSITY;WONG, CHEE KHUEN STEPHEN;PANG, HOCK LYE JOHN;FAN, WEI;LU, HAIJING;LOK, BOON KENG