发明名称 AN INTERCONNECT STRUCTURE AND A METHOD OF FABRICATING THE SAME
摘要 An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.
申请公布号 WO2009061282(A1) 申请公布日期 2009.05.14
申请号 WO2008SG00406 申请日期 2008.10.21
申请人 AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH;NANYANG TECHNOLOGICAL UNIVERSITY;WONG, CHEE KHUEN STEPHEN;PANG, HOCK LYE JOHN;FAN, WEI;LU, HAIJING;LOK, BOON KENG 发明人 WONG, CHEE KHUEN STEPHEN;PANG, HOCK LYE JOHN;FAN, WEI;LU, HAIJING;LOK, BOON KENG
分类号 H01L21/60;B81C3/00;H01L21/44;H01L21/58;H01L23/48 主分类号 H01L21/60
代理机构 代理人
主权项
地址
您可能感兴趣的专利