| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device formed by bonding a circuit board and a lid body member together, in which the adhesive strength between the circuit board and lid body member can be improved. <P>SOLUTION: Provided is the semiconductor device 1 which comprises the circuit board 3, a semiconductor chip 5 mounted on a mounting surface 13a of the circuit board 3, and the conductive lid body member 9 covering the mounting surface 13a while including the semiconductor chip 5 to form a hollow cavity portion between the lid body member 9 and the circuit board 3, and the semiconductor device 1 is characterized in that a wiring portion 25 for electric connection with the lid body member 9 is formed in a circumferential direction over an arrangement surface 3a of the circuit board 3 while the arrangement surface 3a is partially exposed, the arrangement surface 3a being disposed at a periphery of the mounting surface 13a and having the lid body member 9 disposed therein, and that a conductive adhesive for bonding the arrangement surface 3a and lid body member 9 together is applied over the exposed portion of the arrangement surface 3a and the wiring portion 25. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
