TOP TO BOTTOM ELECTRODE CONNECTION ON SINGLE LAYER CERAMIC CAPACITORS

摘要

Disclosed are methodology and corresponding device subject matters for providing single layer ceramic capacitors through the use of significantly reduced numbers of processing steps. An aspect of present methodology resides in the early introduction of a plurality of selectively spaced through holes in an unfired ceramic wafer. Such holes provide connection points between conductive coatings on both sides of a subsequently fired wafer and eliminate the need to perform a previously employed third sputtering step to achieve connection between the layers. The present methodology also provides for end of process determination of final capacitive values for the finished devices.