| 发明名称 |
SLURRY FOR POLISHING RUTHENIUM AND METHOD FOR POLISHING USING THE SAME |
| 摘要 |
A slurry for polishing a ruthenium layer comprises distilled water, sodium periodate (NaIO4), an abrasive and a pH controlling agent.
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| 申请公布号 |
US2009124082(A1) |
申请公布日期 |
2009.05.14 |
| 申请号 |
US20080165252 |
申请日期 |
2008.06.30 |
| 申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
PARK HYUNG-SOON;KIM JIN-WOONG;KWAK NOH-JUNG;CHOI YONG-SOO;SHIN JONG-HAN;RUY CHEOL-HWI;PARK JUM-YONG;KIM SUNG-JUN;PARK JIN-GOO;KIM IN-KWON;KWON TAE-YOUNG |
| 分类号 |
H01L21/304;C09K3/14 |
主分类号 |
H01L21/304 |
| 代理机构 |
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