发明名称 THERMAL HEAD DRIVER, THERMAL HEAD, ELECTRONIC EQUIPMENT, PRINTING SYSTEM, AND LAYOUT METHOD OF THERMAL HEAD DRIVER AND THERMAL HEAD
摘要 PROBLEM TO BE SOLVED: To provide a thermal head driver which can reduce a surge voltage without increasing a chip size and be manufactured by the high-density process. SOLUTION: The thermal head driver (30) for actuating a heating element is equipped with a first output driver (OD1) which actuates a first heating element from first pixel data in synchronization with the variation timing of a strobe signal, a delay inversion circuit (DL2) for delaying the strobe signal and outputting a delay inversion strobe signal reversed, and a second output driver (OD2) which actuates a second heating element from second pixel data in synchronization with the variation timing of the delay inversion strobe signal. The delay inversion circuit (DL2) is composed of one inverter. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009101585(A) 申请公布日期 2009.05.14
申请号 JP20070275185 申请日期 2007.10.23
申请人 SEIKO EPSON CORP 发明人 SAITO TADAMORI
分类号 B41J2/355 主分类号 B41J2/355
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