| 摘要 |
PROBLEM TO BE SOLVED: To greatly improve conveyance efficiency of chips cut out of a semiconductor wafer, to decrease the number of components, and to lower the cost of a device. SOLUTION: In a conveying method for the chip in which the chip 4 cut out of the wafer 1 is conveyed from a pickup position 6 to a placement position 9 of a tray 8, a collet portion 12 for picking up the chip from the wafer is moved reciprocally by a Z-axial driving mechanism in a Z-axial direction to slightly approach or leave the wafer, and translated by an arm member 45 reciprocally swinging and rotating by aθ-axial rotating mechanism 14 to convey the chip from the pickup position to the placement position through the slight Z-axial movement of the collet portion in the translational motion and the reciprocal swinging movement of the arm member. COPYRIGHT: (C)2009,JPO&INPIT |
