发明名称 |
SEMICONDUCTOR DEVICE AND MULTILAYER WIRING BOARD |
摘要 |
A gas or an insulating material having a relative dielectric constant of not more than 2.5 on average is interposed between a first wiring layer and a second wiring layer included in a multilayer wiring structure. Between a wiring of the first wiring layer and a wiring of the second wiring layer, a conductive connector is arranged. Between a predetermined wiring of the first wiring layer and a predetermined wiring of the second wiring layer, an insulating heat conductor having a relative dielectric constant of not more than 5 is arranged. |
申请公布号 |
EP2059103(A1) |
申请公布日期 |
2009.05.13 |
申请号 |
EP20070806064 |
申请日期 |
2007.08.24 |
申请人 |
NATIONAL UNIVERSITY CORPORATION TOHOKU UNVERSITY;FOUNDATION FOR ADVANCEMENT OF INTERNATIONAL SCIENCE |
发明人 |
OHMI, TADAHIRO |
分类号 |
H05K3/46;H01L21/312;H01L21/768;H01L23/12;H01L23/522 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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