| 发明名称 |
Ball grid array package |
| 摘要 |
An apparatus and method includes an integrated circuit disposed in a ball grid array ("BGA") package having interconnects on at least one corner without signal assignments.
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| 申请公布号 |
US7531899(B2) |
申请公布日期 |
2009.05.12 |
| 申请号 |
US20060405337 |
申请日期 |
2006.04.17 |
| 申请人 |
AGILENT TECHNOLOGIES, INC. |
发明人 |
JOHNSON KENNETH W |
| 分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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