THERMALLY CONDUCTIVE ADHESIVES AND ADHESIVE TAPE USING THE SAME

摘要

Disclosed is a thermally conductive adhesive comprising an adhesive polymer resin, a thermally conductive filler and a microhollow filler. The adhesive comprising a microhollow filler that can form a porous structure, in addition to a thermally conductive filler, can provide an adhesive tape having excellent thermal conductivity and adhesive properties.