| 摘要 |
PROBLEM TO BE SOLVED: To provide a heating and pressurizing system capable of joining more optimally semiconductor wafers to each other by performing heater control while taking contact thermal resistance into consideration to control temperatures of joined faces of both semiconductor wafers. SOLUTION: The heating and pressurizing system (70) processes at least two substances (W) to a monolithic substance by heating and pressurizing them. Then, the heating and pressurizing system comprises: an input part (92) inputting conditions for heating or pressurizing a substance; a heater (HT) heating a substance; and a temperature control part (96) controlling the heater based on contact thermal resistance existing in a contacting part between constituents from the substance to the heater, and in a contacting part between the constituents and the substance, and based on the input conditions. COPYRIGHT: (C)2009,JPO&INPIT |
