发明名称 |
PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS |
摘要 |
A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.
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申请公布号 |
US2009114429(A1) |
申请公布日期 |
2009.05.07 |
申请号 |
US20070935834 |
申请日期 |
2007.11.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SRI-JAYANTHA SRI M.;DANG HIEN P.;KHANNA VIJAYESHWAR D.;SHARMA ARUN |
分类号 |
H05K1/03;G06F17/50;H05K3/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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