| 摘要 |
PROBLEM TO BE SOLVED: To shorten time of reference position teaching at each port during equipment starting-up in a semiconductor manufacturing apparatus provided with a positioning device and a conveying robot. SOLUTION: Two points W1 and W2, in which circumference of a disk-shaped object 47 of a wafer or the like and a locus 43 of a detection unit are intersected, are detected; and a center position A of the disk-shaped object is calculated using the two points, a specific point O on a perpendicular bisector 42 of a line segment connecting the two points, and a radius r of the disk-shaped object. This makes the conveying robot perform positioning work; and by using the result, not only modification of a conveying path and reference position teaching in case of starting-up the equipment are mostly automated. In the case where there is a notch, the circumference of the disk-shaped object is detected by two loci of the detection unit and a correct center position is detected. Furthermore, in a disk-shaped object of unknown radius having a notch, the circumference is detected by three loci of the detection unit to obtain a radius, the loci being separated with each other by distance which does not bridge the notch; and accordingly, mix production using a wafer different in diameter becomes possible. COPYRIGHT: (C)2009,JPO&INPIT |
