| 摘要 |
PROBLEM TO BE SOLVED: To provide an test device capable of improving reliability of high-temperature test in which if probes 7A of a probe card 7 partially forced out from a wafer chuck 4 in high-temperature test, probes 7A<SB>1</SB>of this portion are not cooled and can contact a wafer W at substantially the same needle pressure as that of the other probes 7A. SOLUTION: The test device includes: a movable wafer chuck 4 having a built-in temperature adjusting mechanism; the probe card 7 having a plurality of probes 7A disposed on the upper part of the wafer chuck 4; and a first temperature control device 46 for controlling the temperature adjusting mechanism. The test device causes the temperature adjusting mechanism to heat the wafer W on the wafer chuck 4 up to a predetermined temperature under the control of the first temperature control device 46, and inspects the electric characteristics of the wafer W. The wafer chuck 4 includes a heating body 43 opposite to the plurality of probes 7A<SB>1</SB>forced out from the wafer chuck 4 in the high-temperature test of the wafer W. COPYRIGHT: (C)2009,JPO&INPIT |
