| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper surface treatment method which is excellent in chemical resistance and adhesiveness between a copper circuit surface and an insulating resin. SOLUTION: In the copper surface treatment method, the copper surface is treated with an aqueous solution containing an oxidant to form a copper oxide film thereon. Then, the copper surface is treated by aqueous solution containing copper complexing agent, pH regulator and dissolved oxygen. COPYRIGHT: (C)2009,JPO&INPIT |
