| 摘要 |
A system and method for removing heat, in particular for removing heat from a multi-chip module or integrated circuit. The system is a closed system and includes a sealed container, and an evaporator, housed within the sealed container. The evaporator is in thermal communication with a heat source, and includes an evaporator inlet, a plurality of evaporator outlet ports and a plurality of tubes, each tube connecting the evaporator inlet with a tube outlet, each tube containing at least one substance. The system further includes a condenser, also housed within the sealed container, having a plurality of condenser inlet ports, a condenser outlet and closed condenser channels connecting the condenser inlet ports with the condenser outlet. The system further includes a conduit joining the condenser outlet to the evaporator inlet. When the substance is in liquid form in the evaporator inlet, it is in thermal communication with the heat source. As a result of such thermal communication, the substance changes from liquid to gas and moves out of the evaporator, the expanded volume forces the gas into the condenser inlet ports where it moves through the condenser channels and changes from gas to liquid. The liquid moves via wicking from the condenser outlet through the conduit and into the evaporator inlet to begin the cycle again.
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