HEAT SINK MODULE FOR ELECTRONIC COMPONENTS OR CIRCUITS, AND METHOD FOR THE PRODUCTION THEREOF

摘要

A heat sink module for electronic components or circuits comprises a base that is used for contacting the electronic component or circuit and contains a substrate material, and an internal structure of the base. Said internal structure of the base has a duct structure, through the ducts of which a cooling medium flows. An electrical insulation layer is applied to surface areas of the base and the internal structure which face the cooling medium. A method for producing said module is also disclosed.