| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polymer compound excellent in heat resistance and insulating property, to provide a photosensitive resin composition by using the compound, capable of giving a cured pattern or a cured film excellent in pattern forming property, resolution, heat resistance and insulating property, to provide a method of manufacturing a cured pattern excellent in pattern forming property, resolution, heat resistance and insulating property, and to provide electronic devices for semiconductor devices and for display devices with high reliability. <P>SOLUTION: The photosensitive resin composition includes(A) a polymer compound obtained by reacting a monomer expressed by general formula (1) and a monomer expressed by general formula (2), and (B) a photosensitive agent. <P>COPYRIGHT: (C)2009,JPO&INPIT |
