| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be configured to incorporate a capacitor in a ceramic package inexpensively, and to provide a semiconductor device unit. SOLUTION: When a plurality of stacked ceramic substrates 13a to 13g are sintered to form the ceramic package 13, a counter electrode 20 is formed with the ceramic substrate 13g interposed and then the ceramic substrate 13g is enabled to function as a dielectric, so that the capacitor 21 is incorporated in the ceramic package 13. In this case, the capacitor 21 can be constituted at the same time when the ceramic package 13 is formed, so the capacitor can be incorporated inexpensively. COPYRIGHT: (C)2009,JPO&INPIT |
