| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable silicone composition that has a low viscosity, exhibits excellent handling workability and is cured to form a cured product excellent in flexibility, adhesiveness and thermal conductivity. SOLUTION: The curable silicone composition comprises at least (A) a liquid organosiloxane having at least two epoxy groups in one molecule, (B) a compound having a group reactive with an epoxy group, (C) a thermoconductive filler and (D) a silicone powder, preferably an epoxy group-containing silicone rubber powder. The cured product is obtained by curing the composition. COPYRIGHT: (C)2009,JPO&INPIT |
