| 摘要 |
<p>Disclosed is a method of coating an exterior surface of a case used for mobile communication terminals or electronic products with a thin film, which includes forming a sheet or injection molded product, forming a tin or tin-indium alloy thin film layer on the sheet or injection molded product using sputtering, forming a silicon thin film layer on the tin or tin-indium alloy thin film layer using sputtering, and repeating forming the tin or tin-indium alloy thin film layer and forming the silicon thin film layer, thus alternately forming tin or tin-indium alloy thin film layers and silicon thin film layers. Thereby, corrosion resistance and environmentally friendly properties of the thin film are improved, thus solving discoloration problems arising under high-temperature and high-humidity conditions or upon long exposure to UV light. When the alloy thin film in which the tin or tin-indium alloy thin film layers and the silicon thin film layers are alternately formed is provided, problems in which resistance of a film is reduced in proportion to the increase in thickness thereof thus causing the loss of non-conductive properties can be solved, thereby ensuring a high resistance thin film.</p> |
