发明名称 METAL NANOPARTICLES, MANUFACTURING METHOD OF THE SAME, WATER DISPERSION MATERIAL, MANUFACTURING METHOD OF PRINTED WIRING-ELECTRODE, AND PRINTED-CIRCUIT BOARD-DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide metal nanoparticles which easily and quickly form a conductive pattern on a resin substrate of low heat resistance, a manufacturing method therefor a water dispersion material, a manufacturing method of a printed wiring-electrode, and a printed circuit board-device. <P>SOLUTION: The metal nanoparticles include either silver or a silver alloy, and an iron compound, and have a mean particle diameter of 1 nm to 100 nm. In a preferable embodiment, the content of iron atoms in the iron compound is 0.01 atom% to 10 atom% with respect to either of the silver or the silver alloy. The water dispersion material consists of the metal nanoparticles. In the manufacturing method of the printed wiring-electrode, the water dispersion material is applied by coating on the resin substrate, then it is dried at 200°C or less. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009097082(A) 申请公布日期 2009.05.07
申请号 JP20080233027 申请日期 2008.09.11
申请人 FUJIFILM CORP 发明人 HIRAI HIROYUKI
分类号 B22F1/00;B22F9/24;B82Y30/00;B82Y40/00;B82Y99/00;C09D11/00;C09D11/322;C22C5/06;H01B1/22;H01B5/00;H01B5/14;H01B13/00;H05K1/09;H05K3/10 主分类号 B22F1/00
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