| 摘要 |
A method of placing a circuit design on a target device can include subdividing at least a portion of the circuit design into at least a first design-partition and a second design-partition separated by a design-cutline, and subdividing at least a portion of the target device into at least a first device-partition and a second device-partition separated by a device-cutline. The method can include determining a design-cutset corresponding to a design-cutline and calculating a measure of required wire-bandwidth for the device-cutline according to the design-cutset. The length of the design-cutline can be increased according to the measure of required wire-bandwidth, thereby altering the perimeter of the first device-partition and the perimeter of the second device-partition.
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