发明名称 |
Heat dissipation device |
摘要 |
A heat dissipation device includes a heat sink and two conductor bases. The heat sink includes two base plates attached to a graphics card and thermally connecting with two graphics processing units (GPUs) mounted on the graphics card, and a plurality of fins soldered on tops of the base plates. The conductor bases connect with the base plates of the heat sink and thermally connect with other electronic components mounted around the GPUs thereby to dissipate heat generated by the other electronic components. The GPUs and the other electronic components have different heights.
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申请公布号 |
US7529090(B2) |
申请公布日期 |
2009.05.05 |
申请号 |
US20070847302 |
申请日期 |
2007.08.29 |
申请人 |
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
PENG XUE-WEN;CHEN RUI-HUA |
分类号 |
H05K7/20;F28F7/00;H01L23/34 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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