发明名称 |
Punch-through diode and method of processing the same |
摘要 |
A monolithically integrated punch-through diode with a Schottky-like behavior. This is achieved as a Schottky-metal area (16) is deposited onto at least part of the first p-doped well's (9) surface. The Schottky-metal area (16) and the p-doped well (9) form the metal-semiconductor-transition of a Schottky-diode. The overvoltage protection of the inventive PT-diode is improved as the forward characteristic has a voltage drop that is less than 0.5V.
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申请公布号 |
US7528459(B2) |
申请公布日期 |
2009.05.05 |
申请号 |
US20050561895 |
申请日期 |
2005.12.21 |
申请人 |
NXP B.V. |
发明人 |
RITTER HANS-MARTIN;LUEBBE MARTIN;WYNANTS JOCHEN |
分类号 |
H01L27/095;H01L27/07;H01L27/08;H01L29/861;H01L29/872 |
主分类号 |
H01L27/095 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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