发明名称 Multi-layered printed circuit board embedded with filter
摘要 A multi-layered printed circuit board embedded with a filter, the multi-layered printed circuit board using a composite multi-layered printed circuit board formed of at least a high dielectric material stacked with at least a low dielectric material. A plurality of serial or parallel capacitors are disposed in the composite multi-layered printed circuit board so as to form a filter. At least one capacitor is an interdigital capacitor disposed on a low dielectric material. Metal electrodes of the interdigital capacitor are located on the same plane such that the area of the metal electrodes or the spacing between the metal electrodes can be adjusted in advance to precisely control the electrical properties such as the center frequency and the transmission loss of the filter. Problems resulting from alignment errors caused in manufacturing the composite multi-layered printed circuit board can also be prevented.
申请公布号 US7529103(B2) 申请公布日期 2009.05.05
申请号 US20060438363 申请日期 2006.05.23
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 CHEN CHANG-SHENG;JOW UEI-MING;LAI YING-JIUNN;SHYU CHIN-SUN
分类号 H05K1/14 主分类号 H05K1/14
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