| 摘要 |
The invention provides a mold release film for the resin encapsulation of semiconductors which exhibits low gas permeability, little suffers from the staining of a mold with an encapsulating resin, and exerts high mold release properties. The invention relates to a gas-barrier mold release film for the resin encapsulation of semiconductors which comprises a mold release layer (I) exerting excellent mold release properties and a plastic base layer (II) supporting the layer (I), wherein the base layer (II) exhibits a strength of 1 to 50MPa at 200% elongation and 170°C and the mold release film exhibits a xylene gas permeability of 5OE0<SUP>-15</SUP> (kmol m/(s m<SUP>2</SUP> kPa)) or below at 170°C. It is preferable that the layer (I) be made of a fluororesin such as ethylene /tetrafluoroethylene copolymer, while the layer (II) be made of an ethylene/vinyl alcohol copolymer. |
